Sensors Midwest 2017

Moving beyond the basic objective of collecting and reporting raw data from a stretchable or wearable sensor system, integrating processors and actuators enables analysis on that data which can then drive decisions and actions. When this occurs both the value of the product and the complexity of device integration increases.  A series of developments in both scalable manufacturing integration methods and reliability testing are underway at NextFlex in programs with participation from GE, Binghamton University, Georgia Tech, Cal Poly, DuPont, Raytheon, Boeing and others.  Advancements in integrated direct-write solutions, IC integration and reliability test methods will all contribute to driving these intelligent systems to success in the marketplace.